VCI engineers are available to work with you to design custom vertically integrated memory and SiP (system-in-package) solutions that will allow you to benefit from significant size and weight reduction, as well as the system level performance and functionality improvements.

» VCI’s technology is cost effective for high volume, low cost commercial applications

» VCI’s patented stacked die assembly process can be used to manufacture homogeneous memory die stacks to achieve unparalleled storage densities: or mixed device, stacked die, SiP (system-in-package) components.

   » For customers implementing SiP solutions, the reduction in time-to-market afforded by vertical stacking of standard semiconductor die provides a strong competitive advantage over monolithic “system in a chip” implementations, as well as significant NRE cost savings.

   » VCI’s vertical integration technology can be applied to standard semiconductor wafers and requires no modification of the fabrication process by the wafer manufacturer.