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Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low cost ultra high-speed/high-density semiconductor components.
Our proven die-level vertical interconnect technology is capable of meeting the industry’s 3D cost, form factor, density & time to market goals today.
Optomec and Vertical Circuits Partner to Develop Ultra-Fine Pitch 3D Interconnect Solution
July 9, 2009
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Vertical Circuits’ patented vertical interconnect pillar (VIP™) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIP™ solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI’s VIP™ conductors are dispensed on the edge of the die stack utilizing Asymtek’s high speed, high accuracy jetting technology on the Axiom® dispenser.
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Vertical Circuits enables packaging solutions for Memory and Mixed Die applications.
» Mobile Phone
» Portable Media Player
» Servers
» Networking
» Mobile Computing
» Handheld Devices
» Solid State Drives
» Medical Electronic Instruments
» Removable Storage
Vertical Circuits will be presenting at the following upcoming conferences:
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