| 3D Packaging Interconnect for Mobile Internet Wafer & Device Packaging and Interconnect, January/February 2010 |
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.jpg) 16 Chip Flash Stack |
 Die Stack with ViP |
.jpg) 16 Chip Stack with ViP |
| A Letter from Sunil Kaul President & CEO |
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| High-Performance MCP Products – a Smart Move Simon McElrea, Vice President of Product Development & Management |
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| Interconnect functionality in a decreasing form factor Yin Chang, Vice President of Sales & Marketing |
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Vertical Circuits’ patented vertical interconnect pillar (VIP™) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIP™ solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI’s VIP™ conductors are dispensed on the edge of the die stack utilizing Asymtek’s high speed, high accuracy jetting technology on the Axiom® dispenser. | |
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micropede™Vertical Circuits' wafer-level approach to integrated circuit die stacking, the micropede™ , offers a true chip-scale footprint comparable to thru-silicon-via (TSV) without the cost, complexity, or need for die redesign. First, a protective dielectric coating is applied to insulate the die edges, Then, vertical conductors are formed on the edges to interconnect a laminated stack of die into a simple “package-less” form-factor. The micropede™ is a finished electronic component which can be surface-mounted onto any common electronic substrate or incorporated within any standard electronic component package. Micropedes™ can be made from as few as 2 or as many as 1024 die and offer excellent thermal and electrical performance due to their small size, short vertical signal path and minimalist construction. |
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A variant on the micropede™, Vertical Circuits’ Z-Sky™, integrates the proprietary vertical interconnect process into a terrace-stack configuration to further reduce the height of the total die-stack by eliminating the need for spacers, wires, or interposers of any kind. The Z-Sky™ technology requires only a 50um horizontal “terrace” per die to form the vertical interconnection (as compared to wire-bonding technology which requires approximately 300um per die), and this allows for continued vertical integration without paying a penalty in footprint. Z-Sky™ integrates with industry-standard die-thickness roadmaps, and is ideal for products requiring low-cost ultra-high-density die-stacking. |
