Vertical Circuits and DISCO Corporation Partner to Enable High Density 3D Packaging SolutionScotts Valley, CA January 28, 2009Collaboration to deliver high volume manufacturing tools and processes for VCI’s 3D conformal interconnect technology Scotts Valley, CA – 20 January, 2009 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced the formation of a strategic partnership with DISCO Corporation, a global leader in precision cutting, grinding, and polishing tools. The partnership was established to enable the delivery of high volume manufacturing equipment and process solutions for VCI’s advanced die stacking and conformal interconnect technology to IC fabricators and sub-contractor packaging companies worldwide. Vertical Circuits high density 3D packaging process requires leading wafer thinning and dicing techniques, such as those provided by DISCO, to prepare the die for stacking and the application of conductive polymer conformal interconnects. The VCI solution enables significantly smaller form factor, high die count, stacks than traditional wire-bonded solutions and, unlike emerging TSV technologies, integrates easily into established IC package manufacturing lines. Through an efficient, parallel, manufacturing process and a lower BOM (bill of material), VCI’s patented 3D technology offers a cost effective, high density, packaging solution. By leveraging DISCO’s proven high volume manufacturing (HVM) backgrind and dicing tools, VCI is able to deliver a low cost, HVM ready, low profile 3D packaging solution. “We are delighted to be partnered with DISCO, the leading innovator for advanced wafer thinning, dicing, and lamination equipment,” said Simon McElrea, Vertical Circuits’ Vice President of Product Development. “Their expertise in thin wafer handling and processing solutions, combined with their established global support footprint, enable us to provide the world’s leading and most cost effective high density 3D packaging solution. DISCO’s high volume manufacturing tools play a key role in promoting the broad adoption of VCI’s technology into the existing manufacturing infrastructure.” “VCI's advanced die stacking and interconnect technology provides a cost effective and high-yield solution to the market’s need for ultra high density 3D packaging solutions,” comments Noboru Yoshinaga, General Manager, Overseas Sales Department, DISCO. “DISCO’s advanced kiru (cutting), kezuru (grinding), migaku (polishing) technologies combined with advanced applications know-how and an extensive global support network enable us to provide customers with the comprehensive solutions necessary for the adoption of VCI’s processes in their manufacturing lines.” Vertical Circuits has licensed its conformal interconnect technology to leading global device manufacturers and packaging companies. The technology is ideally suited to meet the market application needs for high capacity removable, as well as embedded, flash memory packaging solutions, including a broad array of memory cards, USB memory, and emerging SSD products. In addition, the low inductance, high performance, characteristics of the conformal conductors make them well suited for DDR2/3 modules, memory / logic device stacks, and specialty device applications. Vertical Circuits and DISCO will be displaying their conformal interconnect, 3D packaging, manufacturing solution and the enabling advanced wafer processing tools at Internepcon Japan, being held at the Tokyo Big Sight, January 28-30, 2009. About Vertical Circuits, Inc. Vertical Circuits Inc., based in Scotts Valley, CA, develops and licenses advanced 3D conformal interconnect packaging technologies that enable its customers to manufacture low-cost, ultra high-speed, high-density semiconductor components. Vertical Circuits die level interconnect solutions were originally developed and implemented in aerospace and military electronics that require the highest standard of quality and reliability and were subsequently used in volume production for high speed server memory modules. Today, Vertical Circuits has leveraged its technology leadership and expanded the adoption of its conformal interconnect solutions to an even broader range of advanced 3D packaging applications – including both die and package level implementations - focused on meeting the semiconductor and electronics industry's growing demand for high density, small form factor packaging. For more information, visit www.verticalcircuits.com. About DISCO Corporation DISCO Corporation provides equipment and process solutions to the semiconductor and electronics industries utilizing our core technologies of kiru (cutting), kezuru (grinding), and migaku (polishing). For more information, please visit: http://www.disco.co.jp CONTACT AT VCI: Yin Chang Vertical Circuits Inc. Tel: +1-831-438-3887 x102 Email: iyc@verticalcircuits.com International Offices: U.S.A.: 10 Victor Square, Scotts Valley CA 95066 +1.831.438.3887 Taiwan: +886-938-637377 CONTACT AT DISCO: Devin Martin DISCO Corporation Tel: +011-81-3-4590-1100 Email: devin_m@disco.co.jp International Office: JAPAN: 13-11 Omori-Kita 2-chome, Ota-ku Tokyo 143-8580 |
