VERTICAL CIRCUITS - BRIDGING THE GAP TO TSVScotts Valley, CA May 3, 2007Vertical Circuits, Inc. announced today release of its near through silicon via (TSV) die stacking technology for high volume, low cost applications. Designed and optimized to address chip scale vertical integration applications, Vertical Circuits’ patented VIP™ (Vertical Interconnect Pillar) process consists of the application of a thin dielectric coating to the semiconductor device to be stacked, while still in wafer form, and a vertical interconnection to the sides of the die stack. Unlike TSV based processes, there are no changes required in the fundamental die design or layout. Vertical Circuits’ VIP™ technology enables the stacking of multiple same size devices for high density memory applications as well as mixed size devices, from multiple vendors, for chip scale SiP (System in Package) solutions. In addition to achieving very high levels of integration and performance, Vertical Circuits’ customers are able to significantly shorten their time to market for their advanced multi-chip module solutions. According to Marc Robinson, VP, CTO & Business Development for Vertical Circuits, “The development of our VIP™ technology was based on the premise of utilizing readily available materials and standard semiconductor assembly equipment to provide the lowest cost methodology for achieving the device density, performance, and reliability required by today’s portable consumer and high performance electronic systems applications .” Simon McElrea, VP of Product Management and Development for Vertical Circuits noted that “Consumers now consider excess memory to be a “given” in portable consumer devices such as smart phones, music players, solid state drives and digital cameras. The exponential growth of these products, which require ever-increasing numbers of memory die in an ever-decreasing space, has driven many customers to adopt Vertical Circuits ultra-dense/low-cost chip-stacking solutions for Flash, DRAM and mixed-memory products. Nobody wants to run out of memory or pay a premium for it anymore”. The company now offers a complete set of stacked die packaging process modules and technology, providing semiconductor and electronic system manufacturers the capability to address dense packaging applications for memory in blade server memory modules and consumer products; and mixed die logic & memory stacks for graphics engines and numerous portable device applications processors. About Vertical Circuits, Inc. Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect technology, products, services and intellectual property for the manufacture of low cost, ultra high-speed/high-density semiconductor components. |
