Small form factor» Low height» Small Footprint » True chip scale – near TSV » High density » 2, 4, 8, 16, 32…high die stacks » Multi tier chip select » Solution for embedded and removable FLASH storage High speed performance» Reduced Parasitics» Excellent signal integrity and low skew » Solution for DDR2 and DDR3 speeds Other Features & Benefits» VCI’s patented ViP™ technology can be used for stacking any type of semiconductor die» Memory, DSP, Analog, etc. » Same size or mixed size die » Low temp stacking process (150C max) » No-lead stacking process » Utilizes standard high-volume semiconductor assembly equipment » Low cost – High-volume process |
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